Freedom Photonics offers design, micro and nano fabrication and testing in support of your research and development needs. We have extensive prototyping capabilities, enabled by our vast experience and access to the state-of-the-art National Nanotechnology Infrastructure Network (NNIN) facilities.

One of Freedom Photonics goals in creating an optical package for our Photonic Integrated Circuits is to have a single package for all of our current projects.

Advantages to a single package for all projects:

• Packaging is one of the largest expenses for commercialization of our devices, so there is great value in having a single package that could be compatible with all.
  
• The same footprint is also important for the electronics board design compatibility.

Freedom Photonics has developed internal packaging facilities – a newly acquired ficonTEC 4500 laser welder/epoxy packaging system.

With our internal packaging capability, our custom low-profile package has been designed for high flexibility to be able to package a wide range of custom photonic components, from receivers to transmitters and transceivers or even higher complexity custom PICs for routing applications. By being able to use this custom package, a direct route to the development of producing hermetically sealed packages is taken.