Custom Fabrication and Process Design
  • Photolithography (Stepper/Contact Aligner)
  • Holography (laser mirror definition)
  • Wet Chemical Etching
  • Reactive Ion Etching (REI) of semiconductor, dielectric
  • Inductively Coupled Plasma (ICP) Etching of semiconductor, dielectric
  • Advanced Metalization (Ti/Pt/Au, Ni/Au/Ge/Ni/Au...)
  • Wafer Lapping and/or Polishing
  • Cleaving
  • Wafer-Bonding, Pick and Place, Wire Bonding